The Trenz Electronic TE0304 demo carrier board provides low-cost connection and extension to the Trenz Electronic TE0300 Xilinx Spartan-3E industrial micromodule series.

The demo carrier board has a total of 23 differential signal pairs routed with a differential impedance of 100 ohm to header connectors J2 and J4. These lines can be used for high speed signaling up to 666 Mbit/s per differential pair (see Xilinx Application Note XAPP485).
The demo carrier board has a total of 10 single ended lines routed to header connectors J2 and J4. These lines can be used for low-speed and medium-speed signals.

Moreover, the demo carrier board provides several application-ready standard interfaces.

Specifications

• 23 differential pairs (for high-speed signals) available on header connectors with 2.54 mm (100 mil) pitch
• 10 single-ended lines (for low- / medium-speed signals) available on header connectors with 2.54 mm (100 mil) pitch
• Board supply via DC jack or screw terminals (optionally: industrial USB connector)
• Small form factor: 115 mm x 79 mm

Application ports

• 1 x microSD (socket)
• 1 x 12-pin Pmod or, alternatively, up to 2 x 6-pin Pmods
• 2 x PS/2 (female)
• 1 x RS-232 DCE (female)
• 1 x RS-232 DTE (male)
• 1 x VGA (female) 32,768 colors per pixel

Advanced ports

• 1 x JTAG Port
• 1 x industrial USB Port (typically not populated)
• 2 x 20-pin header connectors (2.54 mm pitch)
• 1 x 20-pin header connectors (1.27 mm pitch) suitable for Optomotive Cameleon camera head
• 1 x push-button

Sample applications

• Optomotive Cameleon smart camera
• Genode FX FPGA Graphics
• Retrocomputing emulation
• Retrogaming emulation

Package content

• application carrier board

Available for download

• User Manual
• Schematics
• Assembly Diagram

Ordering information

• manufacturer: Trenz Electronic
• manufacturer part name: TE0304 (demo carrier board for industrial micromodule)
• manufacturer part code: TE0304-00

Documentation

• manufacturer part page
• part documentation archive