manufacturer: Trenz Electronic
part name(s): TE0300, TE0300-01 (big, Micron Technology, low-power)
part code(s): TE0300-01BMLP
product family: industrial FPGA modules

The FPGA Micromodule integrates a leading-edge Spartan-3E 1600K gates FPGA, an USB2.0 microcontroller, configuration Flash and power supply on a tiny footprint. A large number of configurable I/Os are provided via shock proof B2B mini-connectors.
Thus, the Micromodule is ideally suited for battery-powered and small-sized applications.

It is intended to be used as an OEM board, or combined with our carrier boards, the micromodule serves as a powerful system widely used for educational and research activities.

Boards with other configurations, or equipped with industrial temperature grade parts are available on request

Software for SPI Flash programming over USB, as well as reference designs for high speed data transfer over USB are included.

Key features

• Small and ruggedized design
• Versatile
• 3 on-board DC-DC converters for high efficiency
• x16 DDR with up to 666 MByte/s bandwidth
• Supports OPB and MIG DDR cores

Specification

• Xilinx Spartan-3E FPGA XC3S1600E-4FGG320C
• Cypress FX2 USB2.0 CY7C68013A-56LFXC
• Onboard 100 MHz oscillator for low-power consumption
• 32 MBit SPI Flash for configuration and user data
• 512 MBit DDR Ram (Micron Technology)
• 104 I/Os + 6 inputs available on B2B connectors
• 2 x 80 pin Hirose DF17 shockproof B2B connectors
• 1 x LED
• 1 x push button
• Power supply input via USB, or B2B
• Programming is implemented via JTAG, SPI or USB. (The required adaptor is not included)
• Size only 40.5 mm x 47.5 mm

Available for download

• User's manuals
• Product brief
• Application notes
• Demo project files
• Schematics and placeplan
• CAD library files
• Data sheets of major components

Links

• http://www.trenz-electronic.de/products/fpga-boards/trenz-electronic/industrial-micromodules.html
• http://www.trenz-electronic.de/support/download-area/industrial-micromodules.html
• documentation