The Trenz Electronic TE0303 prototyping carrier board provides low-cost connection and extension to the Trenz Electronic TE0300 Xilinx Spartan-3E industrial micromodule series.

The prototyping carrier board has a total of 42 differential signal pairs routed with a differential impedance of 100 ohm to header connectors J1 through J4. These lines can be used for high speed signaling up to 666 Mbit/s per differential pair (see Xilinx Application Note XAPP485).
The prototyping carrier board has a total of 26 single ended lines routed to header connectors J2 and J4. These lines can be used for low-speed and medium-speed signals.

Specifications

• 42 differential pairs (for high-speed signals) available on header connectors with 2.54 mm (100 mil) pitch
• 26 single-ended lines (for low- / medium-speed signals) available on header connectors with 2.54 mm (100 mil) pitch
• Board supply via DC jack, screw terminals or USB connector
• Small form factor: 115 mm x 70 mm

Prototyping ports

• 1 x JTAG Port
• 1 x USB Port B-type
• 4 x 20-pin header connectors (2.54 mm pitch)
• 1 x push-button

Sample applications

• practically any FPGA-based application

Package content

• prototyping carrier board
• 4 x 20-pin header connectors (2.54 mm pitch)

Available for download

• User Manual
• Schematics
• Assembly Diagram

Ordering information

• manufacturer: Trenz Electronic
• manufacturer part name: TE0303 (prototyping carrier board for industrial micromodule with unsoldered headers)
• manufacturer part code: TE0303-00NC

Documentation

• manufacturer part page
• part documentation archive