Trenz Electronic: TE0808 (TE0808-04-09-1EE-S)
TE0808-04-09-1EE-S Starter Kit

Quantità Prezzo unitario
Fino a 9 € 1.999,00 (€ 2.438,78) *
Da 10 € 1.799,10 (€ 2.194,90) *
Da 25 € 1.699,15 (€ 2.072,96) *
Da 50 € 1.599,20 (€ 1.951,02) *
Da 100 € 1.499,25 (€ 1.829,09) *
Da 250 € 1.399,30 (€ 1.707,15) *
Da 500 € 1.299,35 (€ 1.585,21) *
Da 1000 € 1.199,40 (€ 1.463,27) *

Prezzo IVA esclusa (inclusa) più spese di spedizione.

Tempo di consegna a richiesta

  • 100442
  • MFMP-100442 (+ MFMP-SPESE_FISSE, opz. "codici del catalogo")
  • Trenz Electronic
  • TE0808-04-09-1EE-S
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  • Please contact us.
The Trenz Electronic Starter Kit TE0808-04-09-1EE-S consists of a TE0808-04-09EG-1EE module with... altro
Informazione prodotto "Trenz Electronic: TE0808 (TE0808-04-09-1EE-S)"

The Trenz Electronic Starter Kit TE0808-04-09-1EE-S consists of a TE0808-04-09EG-1EE module with ZU9 on a TEBF0808-04 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 8 GB micro SD card, an USB cable, screws and bolts.

The Module: TE0808-04-09-1EE

The Trenz Electronic TE0808-04-09EG-1EE is a MPSoC module integrating a Xilinx Zynq UltraScale+, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
  • ZU9EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Design Suite - HLx Edition Download

Vivado Design Suite HLx Editions include Partial Reconfiguration at no additional cost with the Vivado HL Design Edition and HL System Edition. In-warranty users can regenerate their licenses to gain access to this feature.

Overview of all Editions of Vivado Design Suite Editions

The Base Board: TEBF0808-04

The Trenz Electronic TEBF0808 UltraITX+ base board has been developed individually for the TE0808 UltraSOM+ MPSoC.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA Audio
    • Intel 9-pin Power-/Reset-Button, Power-/HD-LED
    • PC-BEEPER
  • On-board Power- / Reset-Switches
  • 2 x Configuration 4-bit DIP-switches
  • 2 x Optional 4-wire PWM fan connectors
  • PCIe Slot - one PCIe lane (16 lane connector)
  • CAN FD Transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x  Microchip 24AA025E48T-I/OT)
  • Dual SFP+ Connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA Connector
  • 2 x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0))
  • 1 x USB3.0 on-board connector with two ports
  • FMC HPC Slot (FMC_VADJ max. VCCIO)
  • FMC Fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator SI5338A
  • 2x SMA coaxial connectors for clock signals
  • MicroSD- / MMC-Card Socket (bootable)
  • 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit)
  • 2 x System Controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 2 pre-assembled TE0790 JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLDs
  • 20-pin ARM JTAG Connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card lenght: 255 mm (inner enclosure)
  • Maximum graphic card lenght: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
  • 1 x TE0808-04-09EG-1EE MPSoC module with ZU9
  • 1 x TEBF0808-04 base board
  • 1 x Heatsink MBH31001-15W/2.6
  • 1 x TE0790-02 XMOD FTDI JTAG adapter (compatible with Xilinx-Tools), pre-assembled
  • 1 x TE0790-02L XMOD FTDI JTAG adapter (independent from Xilinx-Tools), pre-assembled
  • 1 x 8 GB Class 4 microSDHC card
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 2 x Phillips screws, M3 x 6, pan head, zinc coated
  • 2 x Spacer bolts, M3, 10 mm

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

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