|Fino a 9||€ 3.100,00 (€ 3.689,00) *|
|Da 10||€ 2.790,00 (€ 3.320,10) *|
|Da 25||€ 2.635,00 (€ 3.135,65) *|
|Da 50||€ 2.480,00 (€ 2.951,20) *|
|Da 100||€ 2.325,00 (€ 2.766,75) *|
|Da 250||€ 2.170,00 (€ 2.582,30) *|
|Da 500||€ 2.015,00 (€ 2.397,85) *|
|Da 1000||€ 1.860,00 (€ 2.213,40) *|
Prezzo IVA esclusa (inclusa) più spese di spedizione.
Prodotto disponibile dal 08 maggio 2020
- Codice Mirifica: 101157
- Codice MEPA: MFMP-101157 (+ MFMP-SPESE_FISSE, opz. "codici del catalogo")
- Nome produttore: Trenz Electronic
- Codice produttore: TEB0911-04-9BEX1FA
- A magazzino: 0
- Supplier lead time: Please contact us.
This article is the replacement of the TEB0911-04-ZU9EG1E. All changes are included in the Product Change Notification (PCN).
The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 4 GByte Flash memory for configuration and operation, DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.
All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
- Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
- 1156 Pin Package
- 64bit DDR4 SO-DIMM (PS connected)
- M2 PCIe SSD (1-Lane)
- eMMC (bootable)
- Dual QSPI Flash (bootable)
- System Controller(LCMXO2-7000HC)
- Power Sequencing
- IO Expander
- Configurable PLLs
- GTH/GTP Reference CLKs
- 4 x FMC
- 4 GTH per FMC
- 68 ZynqMP PL IO per FMC
- DisplayPort (2-Lanes)
- RJ34 ETH + Dual USB3 Combo
- Dual Stack SFP+
- SD (bootable)
- Status LEDs
- 2 x FMC
- 4/2 GTH
- 12 ZynqMP PL IO per FMC
- 56 SC IO per FMC
- USB JTAG/UART ZynqMP
- USB JTAG/GPIO FMC
- CAN FD (DB9 Connector)
- SMA (external CLK)
- 5-pin 24 V power connector
- 406 mm × 234.30 mm, please download the assembly diagram for exact details.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Scope of Delivery
- 1 x TEB0911 UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG
All modules produced by Trenz Electronic are developed and manufactured in Germany.
The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.