Trenz Electronic: TE0808 (TE0808-04-09EG-1EL)
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG, 4 GByte DDR4, low profile

Quantità Prezzo unitario
Fino a 9 € 1.079,00 (€ 1.284,01) *
Da 10 € 971,10 (€ 1.155,61) *
Da 25 € 971,10 (€ 1.155,61) *
Da 50 € 863,20 (€ 1.027,21) *
Da 100 € 809,25 (€ 963,01) *
Da 250 € 809,25 (€ 963,01) *
Da 500 € 722,93 (€ 860,29) *
Da 1000 € 722,93 (€ 860,29) *

Prezzo IVA esclusa (inclusa) più spese di spedizione.

Pronto per la spedizione in 2 o 3 giorni lavorativi

  • 101734
  • MFMP-101734 (+ MFMP-SPESE_FISSE, opz. "codici del catalogo")
  • Trenz Electronic
  • TE0808-04-09EG-1EL
  • 13
  • Please contact us.
This module is identical to variant TE0808-04-9BE21-A except the 1 mm Samtec connectors.... altro
Informazione prodotto "Trenz Electronic: TE0808 (TE0808-04-09EG-1EL)"

This module is identical to variant TE0808-04-9BE21-A except the 1 mm Samtec connectors.

The Trenz Electronic TE0808-04-09EG-1EL is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG, 4 GByte DDR4 SDRAM with 64-Bit width, 128 MByte Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

Key Features

  • Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
  • ZU9EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Design Suite - HLx Edition Download

Vivado Design Suite HLx Editions include Partial Reconfiguration at no additional cost with the Vivado HL Design Edition and HL System Edition. In-warranty users can regenerate their licenses to gain access to this feature.

Overview of all editions of Vivado Design Suite

Xilinx Licensing FAQ

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x MPSoC Module TE0808-04-09EG-1EL with Xilinx Zynq UltraScale+ ZU9EG, low profile

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

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