Product Description
The AXW47 development board adopts the Zynq UltraScale+ RFSoC Gen3 series XCZU47DR FPGA chip, integrating RF direct sampling data converters, FPGA logic, a complete ARM processor subsystem, and high-speed transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF input/output interfaces are designed for frequency bands up to 6 GHz. This provides a comprehensive RF signal chain, maximizing I/O channel density with high bandwidth, heterogeneous processing capabilities, and low power consumption. The carrier board expands an AMD XCKU115 pure-logic FPGA for backend data processing acceleration.
It meets the requirements of applications including 5G wireless infrastructure, cable TV access, test and measurement, satellite communications, phased-array radar/digital array radar, and other high-performance RF scenarios.
Applications
5G FR1/FR2 RF and baseband
phased array system
Radar System
Software-Defined Radio
Medical Imaging Systems
Spectrum monitoring
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ RFSoC:
◆ ARM® quad-core Cortex™-A53 up to 1.333GHz
◆ ARM® dual-core Cortex™-R5F up to 533MHz
◆ 16nm FinFET+ FPGA fabric
◆ Digital RF-ADC, RF-DAC● Pluggable module with 3x 240pin board-to-board connectors
● 4 GByte (64-bit) DDR4 SDRAM on PS
● 2 GByte (32-bit) DDR4 SDRAM on PL
● 256 MB QSPI Flash
● 32 GByte eMMC Flash on PSBase Board
● XCKU115 chip (Pure Logic FPGA Chip)
● 2x 64MB QSPI flash
● 16x 1 GByte (64-bit) DDR4 SDRAM
● 4 x M.2 Interface
● 2 x MGB Interface
● 2x 40G QSFP+fiber optic
● 1x 10G SFP+ fiber optic
● 1 x Gigabit Ethernet
● RF SMBs
◆ 8 x 14bit RF-ADC @ 5.0 GSPS
◆ 8 x 14bit RF-DAC @ 9.85 GSPS● 2 x USB3.0
● 2x USB&JTAG
● 1x SD Card
● 4 x LED+8x LED (User defined indicator lights)
● 5 x KEY
● 12V single supply
● Dimensions: 260 x 215 mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories
Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 2 | Network cable | 1 |
| Type-C cable | 1 | The power adapter | 1 |
| Power adapter cable | 1 | SMA cable | 1 |
| Data USB flash drive | 1 | SD card | 1 |
Product Matrix
| Product Model | Preferred Model | FPGA Devices | DDR4 SDRAM (SoM) | DDR4 SDRAM (Base Board) | QSPI Flash | RF-ADC | RF-DAC | GTY | GTR | |
|---|---|---|---|---|---|---|---|---|---|---|
| AXW47 | √ | XCZU47DR-2FFVE1156I | 6 GB | 16 GB | 256 MB | 8 | 8 | 8 | 4 |
