Trenz Electronic GmbH
Heat Sink for Trenz Electronic Modules TE082x/TE0841 (BGA-STD-045)
Standard heat sink for TE0820, TE0821, TE0823 and TE0841 with thermopad made of black anodised aluminium with vertically mounted lamella.
Item number VAR-827000720
Out of Stock, restocking in progress
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Located in: Germany
EUR 2.85
*
Content
1 piece
Log in and get better prices. Or contact us and request B2B status.
* Excl. VAT excl. Shipping
The BGA-STD-045 is a 23 x 23 x 18 mm standard heat sink with thermal tape. It is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array.
Features
- Material: Aluminium
- External dimensions: 23 x 23 x 18 mm
- Thermal resistance: 14.7°C/W
- Pad size: 20 x 20 mm
Scope of Delivery
- 1 x Heat sink for Trenz Electronic module from TE0820/TE0821/TE0823/TE0841 series
Additional Information
- Manufacturer: ABL HEATSINKS
- Manufacturer's article number: BGA-STD-045
- RoHS conform: yes
- Support Forum
| Item ID | 100608 |
| Condition | New |
| Legacy item ID | 2754 |
| Model | BGA-STD-045 |
| Manufacturer | Trenz Electronic GmbH |
| Manufacturing country | Germany |
| Content | 1 piece |
| Weight | 11 g |
| Net weight | 11 g |
| Customs tariff number | 84715000 |
