Trenz Electronic GmbH
Heat Sink for Trenz Electronic Modules TE082x/TE0841 (BGA-STD-045)
Standard heat sink for TE0820, TE0821, TE0823 and TE0841 with thermopad made of black anodised aluminium with vertically mounted lamella.
Référence de l’article VAR-827000720
En rupture de stock, réapprovisionement en cours
Délais d'exécution 3 jours. Pour les commandes d'une valeur totale nette inférieure à 70 euros, nous facturerons des frais de traitement de 15 euros.
2,85 EUR
*
Contenu
1 pièce
* Hors TVA hors Frais de livraison
The BGA-STD-045 is a 23 x 23 x 18 mm standard heat sink with thermal tape. It is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array.
Features
- Material: Aluminium
- External dimensions: 23 x 23 x 18 mm
- Thermal resistance: 14.7°C/W
- Pad size: 20 x 20 mm
Scope of Delivery
- 1 x Heat sink for Trenz Electronic module from TE0820/TE0821/TE0823/TE0841 series
Additional Information
- Manufacturer: ABL HEATSINKS
- Manufacturer's article number: BGA-STD-045
- RoHS conform: yes
- Support Forum
| ID de l’art. | 100608 |
| État | |
| ID de l'ancien article | 2754 |
| Modèle | BGA-STD-045 |
| Fabricant | Trenz Electronic GmbH |
| Pays de fabrication | Allemagne |
| Contenu | 1 pièce |
| Poids | 11 g |
| Poids net | 11 g |
