Trenz Electronic GmbH

UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+ (TEBF0808-04A)

Baseboard developed for Trenz Electronic TE0803, TE0807 and TE0808 UltraSOM+ MPSoC modules.


Référence de l’article VAR-827000798


En rupture de stock, réapprovisionement en cours
Délais d'exécution 3 jours. Possible de commander, délai de livraison sur demande.

540,00 EUR *
Contenu 1 pièce

* Hors TVA hors Frais de livraison

This article is the replacement for the TEBF0808-04. All changes are included in the Product Change Notification (PCN).

The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0803, TE0807 and TE0808, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available. 

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 32 GBit (4 GByte) on-board eMMC Flash (8 banks a 4 GBit)
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

Scope of Delivery

  • 1 x TEBF0808-04A UltraITX+ base board for Trenz Electronic's TE080x series MPSoCs

Including pre-assembled accessories

  • 2 x XMOD FTDI JTAG adapter for programming MPSoC and SC CPLDs
    TE0790-03 = compatible with Xilinx tools
    TE0790-03L = not compatible with Xilinx tools

Required Hardware

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

ID de l’art. 100686
État
ID de l'ancien article 2970
Modèle TEBF0808-04A
Fabricant Trenz Electronic GmbH
Pays de fabrication Allemagne
Contenu 1 pièce
Poids 441 g
Poids net 441 g