- Heat Spreader for Trenz Electronic MPSoC-Module TE0813-02(KK0813-02)* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC Modules TE0807 from REV02* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic Modules TE0714 from REV04(KK0714-04)* Exkl. MwSt. exkl. Versandkosten
- CYC1000 with Cyclone 10 FPGA, 8 MB SDRAM, 8 MB Flash, 6.15 x 2.5 cm* Exkl. MwSt. exkl. Versandkosten
- Carrier Board for Trenz Electronic TEM0005 Microsemi SmartFusion2 SoC* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z010-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- GigaBee XC6SLX45-2, 2 x 128 MByte SDRAM, industrial temperature range* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- GigaBee XC6SLX100-2, 2 x 128 MByte SDRAM, commercial temperature range* Exkl. MwSt. exkl. Versandkosten
- GigaBee XC6SLX100-2, 2 x 512 MByte SDRAM, commercial temperature range* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z015-1CLG485I, 1 GByte DDR3L, 4 x 5 cm* Exkl. MwSt. exkl. Versandkosten
- Testboard for the Trenz Electronic MPSoC module TE0865 (TEBT0865-01)* Exkl. MwSt. exkl. Versandkosten
The micromodules designed by Trenz Electronic feature modern Xilinx FPGAs. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC. |