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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 31.74 *
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Digilent Inc.
Academic Solderless Breadboard Kit – Small
1 x 630 tie point terminal strip, 1 x 100 tie point distribution strip, 4.5 x 11,5 cm (1.75 x 4.5")
Item number VAR-827001549
Manufacturer Product Number: 340-015-1
Taric/custom code: 84718090
Available for immediate dispatch: 0
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 6.36
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Content
1 piece
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Features
- Convenient breadboard for constructing small-to-medium circuits
- Self-adhesive backing - can be affixed to any surface
- 1 x 630 tie point terminal strip
- 1 x 100 tie point distribution strip
- 4.5 x 11,5 cm (1.75 x 4.5")
Scope of Delivery
- 1 x Solderless Breadboard Kit - Small
References
- Manufacturer: Digilent Inc.
- Manufacturer's article name: Solderless Breadboard Kit - Small
- Manufacturer's article number: 340-015-1
Resources
Other Digilent products are available on request.
Item ID | 101303 |
Condition | New |
Model | 340-015-1 |
Manufacturer | Digilent Inc. |
Manufacturing country | Taiwan |
Content | 1 piece |
Weight | 73 g |
Net weight | 73 g |
Customs tariff number | 84718090 |
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 31.74 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 31.74 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 31.74 *
* Excl. VAT
excl.
Shipping
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excl.
Shipping
Micromodule with AMD Kintex UltraScale KU040, 2 GB DDR4, 4 x 5, low profile (TE0841-03-41I31-L)
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* Excl. VAT
excl.
Shipping