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TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors (TEB0911-04-9BEX1MA)
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Trenz Electronic GmbH
MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 4 GByte DDR4, 4 x 5,64 cm
Xilinx Zynq Ultra Scale+ XCZU5EV-1SFVC784E, 4 GByte DDR4 SDRAM mit ECC, 2 x 64 MByte QSPI Flash, Samtec ADM6-60 Stecker, Größe: 4 x 5,64 cm
Item number VAR-827001918
Manufacturer Product Number: AM0010-02-5DE21MA
Taric/custom code: 84718090
Available for immediate dispatch: 0
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
EUR 1,402.80
*
Content
1 piece
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Technical characteristic | Value |
---|---|
Item ID | 101623 |
Condition | New |
Legacy item ID | 3617 |
Model | AM0010-02-5DE21MA |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 66 g |
Net weight | 66 g |
Customs tariff number | 84718090 |
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 7.86 *
* Excl. VAT
excl.
Shipping
High IO FPGA Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm(TE0711-02-42I-1-A)
EUR 162.54 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 40.32 *
* Excl. VAT
excl.
Shipping
TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors (TEB0911-04-9BEX1MA)
EUR 3,520.80 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 7.86 *
* Excl. VAT
excl.
Shipping
High IO FPGA Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm(TE0711-02-42I-1-A)
EUR 162.54 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 40.32 *
* Excl. VAT
excl.
Shipping
TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors (TEB0911-04-9BEX1MA)
EUR 3,520.80 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 7.86 *
* Excl. VAT
excl.
Shipping
High IO FPGA Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm(TE0711-02-42I-1-A)
EUR 162.54 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 40.32 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 7.86 *
* Excl. VAT
excl.
Shipping
High IO FPGA Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm(TE0711-02-42I-1-A)
EUR 162.54 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 40.32 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 7.86 *
* Excl. VAT
excl.
Shipping
High IO FPGA Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm(TE0711-02-42I-1-A)
EUR 162.54 *
* Excl. VAT
excl.
Shipping
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
EUR 40.32 *
* Excl. VAT
excl.
Shipping