
Product Description
The FAN6050 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Product parameters
- ● 12V single supply
● Dimensions: 59 x 49 mm form factor
What's Inside the Box
| FAN6050 | 1 |
|---|
Product Matrix
| Product Model | USD Price |
|---|---|
| FAN6050 | 13 |
| Technisches Merkmal | Wert |
|---|---|
| Art.-ID | 102298 |
| Zustand | Neu |
| Modell | FAN6050 |
| Hersteller | Alinx Electronic Limited |
| Herstellungsland | China |
| Inhalt | 1 Stück |
| Gewicht | 1000 g |
| Netto-Gewicht | 1000 g |
Alinx Electronic Limited
Alinx FAN6050 Heatsink Kit
The FAN6050 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Artikelnummer VAR-827002738
Hersteller-Teilenummer: FAN6050
Taric/custom code: 8542399000
Lagerbestand: ${ $store.getters.currentItemVariation.stock.net }
Luftfracht-Express-Import zweimal pro Woche ab Werk. Zollabfertigung erfolgt. Lieferzeit 5 bis 10 Tage.
Artikel wird versendet ab D-Riedlingen.
15,08 USD
*
Inhalt
1 Stück
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* Exkl. MwSt. exkl. Versandkosten
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