Product Description

The HEA13 FPGA development board integrates a Xilinx Virtex Ultrascale+ FPGA with an NVIDIA Jetson AGX Orin/Thor module, interconnected via PCIe Gen3 x8. The ACVU13 core board features 20GB of DDR4 and four QSFP28 (100G) interfaces. The AGX Orin module delivers up to 275 TOPS of AI performance, while the Thor module provides an impressive 2070 TOPS. This platform is ideal for applications in robotics, autonomous driving, edge AI, and data center acceleration.

Applications

-> Compute Acceleration
-> Machine Learning and AI
-> Network Acceleration
-> Wired Communications
-> 5G Baseband
-> Radar
-> Test and Measurement
-> Emulation and Prototyping

Key Features

-> AMD Virtex Ultrascale+™ XCVU13P:
-> 16nm FinFET FPGA fabric
-> Integrated 100G Ethernet MAC and 150G Interlaken cores
-> 76 x GTY transceivers, up to 28.21 Gbps
-> More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
-> 2 x 10GB (80bit) DDR4 SDRAM
-> 256MB QSPI Flash
-> 1 x NVIDIA Jetson AGX Orin Series Modules Interface
-> 4 x 100Gbps QSFP28 connectors
-> 2 x FMC+-> FMC1+ has 122 FPGA ios and 16 Lane GTY
-> FMC2+ has 168 FPGA IOs and 16 lane GTY
-> 1 x Gigabit Ethernet on PL
-> 1 x UART
-> 1 x Micro SD
-> 2 x SMA (2 x in )
-> 3 x LED
-> 3 x KEY
-> 12V single supply
-> Dimensions: 271 x 200 mm form factor
NVIDIA JETSON ORIN/THOR Series System-> NVIDIA Jetson Thor Series Modules:
-> Jetson Thor Series Modules 128 GB 256bit LPDDR5X memory: Up to 2070 TFLOPs (Need to purchase separately) . If you want to purchase them, please contact sales@alinx.com or sales.online@alinx.com to know more details.)-> NVIDIA Jetson Orin NX Module:
-> Jetson AGX Orin Modules 64GB: Up to 275 TOPs (Need to purchase separately)
-> Jetson AGX Orin Modules 32GB: Up to 200 TOPs (Need to purchase separately)
(*jetson AGX Orin 64GB package and Jetson AGX Orin 32GB package are offered separately. lf you want to purchase them, please contact sales@alinx.com or sales,online@alinx.com to know more details.)-> 1 x DP Interface for NVIDIA JETSON AGX Orin Modules
-> 1 x Gigabit Ethernet ->10G->for NVIDIA JETSON AGX Orin Modules
-> 1 x Gigabit Ethernet->5G->for NVIDIA JETSON Thor Series Modules
-> 1 x M.2 SSD interface for NVIDIA JETSON AGX Orin Modules
-> 1 x M.2 WIFI/BT interface for NVIDIA JETSON AGX Orin Modules
-> 2 x USB3.2 Type-C for NVIDIA JETSON AGX Orin Modules
-> 1 x EEPROM: 24AA04 I/SN, 4-Kbit connected to NVIDIA JETSON AGX Orin Modules
-> 1 x Micro SD 2.0 for NVIDIA JETSON AGX Orin Modules
-> 40-pin connector for NVIDIA JETSON AGX Orin Modules

Caractéristique technique	Valeur
ID de l’art.	103796
État
ID de l'ancien article
Modèle	HEA13
Fabricant	Alinx Electronic Limited
Pays de fabrication	Chine
Contenu	1 pièce
Poids	1000 g

Board Features

Featuring the AMD/Xilinx Virtex Ultrascale+ XCVU13P-2FHGB2104I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+ based application.

* The HEA13 development board consists of a ACVU13 SoM and base board. If you want to purchase ACVU13 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Virtex Ultrascale+ XCVU13P FPGA development board and Some accessories

The Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.

System-on-Module	1	Base Board	1
Mini USB Cable	1	USB Downloader Cable / set	1
12V Power Adapter	1	Heatsink Kit (preinstalled)	1
SMA Cable	1	SD Card	1