Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05 | MIRIFICA Store

Please check assembly instructions!

Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 C/Watt.

The heatsink is mounted on the chipset.

Features

Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
Heat dissipation material: aluminum
Shape: Square, Pin Fins
Fin type: elliptical pin
Size: 27 x 27mm
Height from base (height of pins): 22.65 mm
Material Finish: Black Anodized
Weight per piece: ca. 18 g
Mounting method: Clip mounting

Scope of Delivery

1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
1 x Heat conduction pad 25 x 25 mm

Additional Information

Manufacturer: Wakefield-Vette
Manufacturer's part number: 904-27-2-23-2-B-0
Download Data SheetPin Fin Heat Sink
Download Assembly Instructions
Overview modules TE0741 series
Trenz Electronic Wiki for 30313 heatsink
Trenz Electronic Wiki Cooling Solutions Overview
Support Forum

Caractéristique technique	Valeur
ID de l’art.	103008
État
ID de l'ancien article	019685677be472099dcbae6273b67346
Modèle	33013
Fabricant	Trenz Electronic GmbH
Pays de fabrication	Allemagne
Contenu	1 pièce
Poids	64 g