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Trenz Electronic GmbH
TEB0911 UltraRack+ MPSoC Board with AMD Zynq UltraScale+ ZU9,6 FMC Connectors (TEB0911-04-9BEX1MA)
MPSoC Board with AMD Zynq UltraScale+ XCZU9EG-1FFVB1156E, 8 GByte 64-Bit DDR4 SO-DIMM (PS connected), M2 PCIe SSD (1-Lane), eMMC (bootable), Dual QSPI Flash (bootable)
Référence de l’article: VAR-827003699
Numéro de produit du fabricant: TEB0911-04-9BEX1MA
Code douane: 84718000
Article situé / expédié de : Riedlingen, Allemagne
The predecessor of this article is TEB0911-04-9BEX1FA. All changes are in the Product Change Notification (PCN).
The Trenz Electronic TEB0911 UltraRack+ board is integrating a AMD Zynq UltraScale+ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.
All parts are at least extended temperature range of 0C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
- 1156 Pin Package
- 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
- Active heat sink (serial number 638088 and above)
- M2 PCIe SSD (1-Lane)
- 8 GByte e.MMC (bootable)
- 2 x 64 MByte Dual QSPI Flash (bootable)
- System Controller(LCMXO2-7000HC)
- Power Sequencing
- IO Expander
- Configurable PLLs
- GTH/GTP Reference CLKs
Front Panel
- 4 x FMC
- 4 GTH per FMC
- 68 ZynqMP PL IO per FMC
- DisplayPort (2-Lanes)
- RJ34 ETH + Dual USB3 Combo
- Dual Stack SFP+
- SD (bootable)
- Status LEDs
Back Panel
- 2 x FMC
- 4/2 GTH
- 12 ZynqMP PL IO per FMC
- 56 SC IO per FMC
- USB JTAG/UART ZynqMP
- USB JTAG/GPIO FMC
- CAN FD (DB9 Connector)
- SMA (external CLK)
- 5-pin 24 V power connector
Board size
- 406 mm 234.30 mm, please download the assembly diagram for exact details
Other assembly options for cost or performance optimization plus high volume prices available on request.
Recommended Software
Vivado Enterprise Edition (paid version)
The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.
Development Support
Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery
- 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with AMD Zynq UltraScale+ ZU9EG
- 1 x active heat sink, pre-assembled
Additional Information
- Manufacturer's article number: TEB0911-04-9BEX1MA
- Trenz Electronic TEB0911 Wiki
- Support Forum
All modules produced by Trenz Electronicare developed and manufactured in Germany.
| Caractéristique technique | Valeur |
|---|---|
| ID de l’art. | 103213 |
| État | |
| ID de l'ancien article | 01968660039770ab9d1518b7af1406ff |
| Modèle | TEB0911-04-9BEX1MA |
| Fabricant | Trenz Electronic GmbH |
| Pays de fabrication | Allemagne |
| Contenu | 1 pièce |
| Poids | 1850 g |
