Articles fréquemment consultés

Trenz Electronic GmbH

UltraITX+ Basisboard for Trenz Electronic TE081X UltraSOM+ (TEBF0818-02A)

Baseboard developed for Trenz Electronic TE0813, TE0817 and TE0818 UltraSOM+ MPSoC modules.


Référence de l’article: VAR-827003705

Numéro de produit du fabricant: TEBF0818-02A

Code douane: 84718000


Disponible pour expédition immédiate: 0

Délais d'exécution 3 jours. Pour les commandes d'une valeur totale nette inférieure à 70 euros, nous facturerons des frais de traitement de 20 euros.

Article situé / expédié de : Riedlingen, Allemagne


574,38 USD *
Contenu 1 pièce



* Hors TVA hors Frais de livraison

The Trenz Electronic TEBF0818 carrier board is a baseboard for the AMD/Xilinx Zynq Ultrascale+ MPSoC modulesTE0813, TE0817 and TE0818, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 xMicrochip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' IC interfaces muxed to MPSoC's IC interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and IC interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm 170 mm.Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

Scope of Delivery

  • 1 x TEBF0818-02A UltraITX+ Baseboard for Trenz Electronic's TE081Xseries MPSoCs

Including pre-assembled accessories

  • 2x XMOD FTDI JTAG adapter for programming MPSoC and SC CPLDs
    TE0790-03 = compatible with Xilinx tools
    TE0790-03L = not compatible with Xilinx tools

Required Hardware

Additional Information

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Caractéristique technique Valeur
ID de l’art. 103219
État
ID de l'ancien article 01967b9f595173819a7fbe64a9159eb6
Modèle TEBF0818-02A
Fabricant Trenz Electronic GmbH
Pays de fabrication Allemagne
Contenu 1 pièce
Poids 490 g